Our wide variety of high-speed camera, optics and lighting options are the best solution for 
Wire-bonding process - check wire loop pattern, lead frame bounding, early detection of wire necking, etc
DIE Pick and Place - analysing DIE cracking, precision positioning of nozzle;SMT Pick and place - how chip is missing during placing, force applied during placing;
Eutectic bonding process;SMT chip packaging on carrier process